Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigat...
Saved in:
| 主要作者: | |
|---|---|
| 企業作者: | |
| 格式: | Thesis 軟件 電子書 |
| 語言: | English |
| 出版: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
|
| 主題: | |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 總結: | This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigate the influence of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the intermetallic compounds formation on the copper substrate. To study the influence of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the mechanical properties and thermal properties. |
|---|---|
| 實物描述: | 1 CD-ROM 12 cm. |
| 參考書目: | Includes bibliographical references |