Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigat...
সংরক্ষণ করুন:
| প্রধান লেখক: | |
|---|---|
| সংস্থা লেখক: | |
| বিন্যাস: | গবেষণাপত্র সফটওয়্যার বৈদ্যুতিন গ্রন্থ |
| ভাষা: | English |
| প্রকাশিত: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
|
| বিষয়গুলি: | |
| ট্যাগগুলো: |
ট্যাগ যুক্ত করুন
কোনো ট্যাগ নেই, প্রথমজন হিসাবে ট্যাগ করুন!
|
| সংক্ষিপ্ত: | This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigate the influence of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the intermetallic compounds formation on the copper substrate. To study the influence of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the mechanical properties and thermal properties. |
|---|---|
| দৈহিক বর্ননা: | 1 CD-ROM 12 cm. |
| গ্রন্থ-পঞ্জী: | Includes bibliographical references |