Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
This research project is focusing the development of Sn-0.7Cu-0.05Ni lead free solder by additional of microalloying which is zinc. The objectives involve in this research project are to study the effect of zinc microalloying into Sn-0.7Cu-0.05Ni lead free solder on the microstructure. To investigat...
Gardado en:
| Autor Principal: | |
|---|---|
| Autor Corporativo: | |
| Formato: | Thesis Software eBook |
| Idioma: | English |
| Publicado: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
|
| Subjects: | |
| Tags: |
Engadir etiqueta
Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!
|
Sexa o primeiro en deixar un comentario!