Lead-free soldering /

Lead-free soldering /

Show other versions (3)

Na minha lista:

Detalhes bibliográficos
Outros Autores:	Bath, Jasbir
Formato:	Livro
Idioma:	English
Publicado em:	New York Springer 2007.
Assuntos:	Lead-free electronics manufacturing processes. Solder and soldering. Electronic industries > Environmental aspects. Environmental protection. Solder and soldering > Standards.
Tags:	Adicionar Tag Sem tags, seja o primeiro a adicionar uma tag!

Registos relacionados

Lead-free soldering
Publicado em: (2007)

Lead-free soldering
Publicado em: (2007)

Lead-free electronic solders : a special issue of journal of materials Science : materials in electronics /
Por: Subramanian, K. N.
Publicado em: (2007)

Lead-free solder process development
Publicado em: (2010)

Lead-free solder process development
Publicado em: (2010)

Electroplating of lead free solder for electronics
Por: Joseph, Shany
Publicado em: (2011)

Electroplating of lead free solder for electronics
Por: Joseph, Shany
Publicado em: (2011)

Lead-free electronic solders : a special issue of journal of materials Science : materials in electronics /
Por: Subramanian, K. N.
Publicado em: (2007)

The effect of multiple reflow soldering for SAC305 and SAC405 on lead-free solder /
Por: Noraini Abdul Kadir
Publicado em: (2015)

Intermetallic formation between lead free solder and copper substrate /
Por: Muhammad Aliff Md Ali
Publicado em: (2014)

Lead free solder : mechanics and reliability /
Por: Pang, John Hock Lye
Publicado em: (2012)

Lead-free electronics : iNEMI projects lead to successful manufacturing /
Publicado em: (2007)

Lead-free electronics : iNEMI projects lead to successful manufacturing /
Publicado em: (2007)

A guide to lead-free solders physical metallurgy and reliability
Por: Evans, John W.
Publicado em: (2007)

A guide to lead-free solders physical metallurgy and reliability
Por: Evans, John W.
Publicado em: (2007)

Structural characterisation and properties of lead-free solders on different surface roughness of copper substrate /
Por: Ong, Chien Chung
Publicado em: (2016)

Structural characterisation and properties of lead-free solders on different surface roughness of copper substrate /
Por: Ong, Chien Chung
Publicado em: (2016)

Lead-free electronics : iNEMI projects lead to successful manufacturing /
Publicado em: (2007)

Lead-free soldering in electronics : science, technology and environmental impact /
Publicado em: (2004)

Lead-free soldering in electronics : science, technology and environmental impact /
Publicado em: (2004)

Mengkaji kesan kandungan antimoni , SB ke atas pembentukan sebatian antara logam semasa proses pengaliran semula secara berganda /
Por: Muhammad Azim Ab Aziz
Publicado em: (2016)

Solders and soldering /
Por: Manko, Howard H.
Publicado em: (1992)

The basic soldering guide handbook /
Por: Winstanley, Alan
Publicado em: (2014)

Solders and soldering : materials, design, production, and analysis for reliable bondiing /
Por: Manko, Howard H.
Publicado em: (2001)

Solders and soldering : materials, design, production, and analysis for reliable bonding /
Por: Manko, Howard H.

Handbook of lead-free solder technology for microelectronic assemblies /
Publicado em: (2004)

Handbook of lead-free solder technology for microelectronic assemblies /
Publicado em: (2004)

Lead free solder technique solder technique for automotive industry
Por: Mohd Hafiz Muhammad
Publicado em: (2006)

Lead free solder technique solder technique for automotive industry
Por: Mohd Hafiz Muhammad
Publicado em: (2006)

Structural integrity and reliability in electronics : enhancing performance in a lead-free environment /
Por: Plumbridge, W. J.
Publicado em: (2003)

Reflow soldering processes : SMT, BGA, CSP AND flip chip technology /
Por: Lee, Ning-Cheng
Publicado em: (2002)

Soldering inspection (set) .
Publicado em: (1985)

Lead-free soldering in electronics : science, technology and environmental impact /
Publicado em: (2004)

Reflow soldering processes and troubleshooting : SMT, BGA, CSP and flip chip technologies /
Por: Lee, Ning-Cheng
Publicado em: (2002)

Effect of additinal element of nickel (ni) in tin-silver-copper (sn-ag-cu) solders during multiple reflow on intermetallics compound (imc) formation between lead-free solders and electroless nickel immersion silver (enimag) substrate /
Por: Mohamad Amirul Asmi Suhadak
Publicado em: (2017)

The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
Publicado em: (2011)

The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
Publicado em: (2011)

Solders and soldering materials, design, production, and analysis for reliable bonding
Por: Manko, Howard H.
Publicado em: (2001)

Solders and soldering materials, design, production, and analysis for reliable bonding
Por: Manko, Howard H.
Publicado em: (2001)

Effect of post-reflow cooling rate and isothermal aging on imc formation between Sn-3.0Ag-0.5Cu-0.5Ni lead-free Solders and Enimag /
Por: Zolhafizi Jaidi
Publicado em: (2016)