Mems packaging /

Mems packaging /

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Detalles Bibliográficos
Autor Corporativo:	Institution of Electrical Engineers
Outros autores:	Hsu, Tai-Ran
Formato:	Libro
Idioma:	English
Publicado:	London INSPEC c2004
Subjects:	Microelectromechanical systems Microelectronic packaging. Microelectronics
Tags:	Engadir etiqueta Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!

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