Cita APA (7th ed.)

Rita Mohd Said. (2019). Development of a robust Sn-Cu based lead-free solder paste. School of Materials Engineering.

Cita Chicago (17th ed.)

Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. Perlis, Malaysia: School of Materials Engineering, 2019.

Cita MLA (8th ed.)

Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. School of Materials Engineering, 2019.