Rita Mohd Said. (2019). Development of a robust Sn-Cu based lead-free solder paste. School of Materials Engineering.
Chicago-Zitierstil (17. Ausg.)Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. Perlis, Malaysia: School of Materials Engineering, 2019.
MLA-Zitierstil (8. Ausg.)Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. School of Materials Engineering, 2019.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.