Παραπομπή σε μορφή APA (7η εκδ.)

Rita Mohd Said. (2019). Development of a robust Sn-Cu based lead-free solder paste. School of Materials Engineering.

Παραπομπή σε μορφή Chicago (17η εκδ.)

Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. Perlis, Malaysia: School of Materials Engineering, 2019.

Παραπομπή σε μορφή MLA (8th εκδ.)

Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. School of Materials Engineering, 2019.