Rita Mohd Said. (2019). Development of a robust Sn-Cu based lead-free solder paste. School of Materials Engineering.
Lua i Stíl Chicago (17ú heag.)Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. Perlis, Malaysia: School of Materials Engineering, 2019.
Lua MLA (8ú heag.)Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. School of Materials Engineering, 2019.
Rabhadh: Seans nach mbeach na luanna seo go hiomlán cruinn i ngach uile chás.