Citazione APA

Rita Mohd Said. (2019). Development of a robust Sn-Cu based lead-free solder paste. School of Materials Engineering.

Stile di citazione Chicago

Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. Perlis, Malaysia: School of Materials Engineering, 2019.

Citazione MLA

Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. School of Materials Engineering, 2019.

Attenzione: Queste citazioni potrebbero non essere precise al 100%.