Citação norma APA

Rita Mohd Said. (2019). Development of a robust Sn-Cu based lead-free solder paste. School of Materials Engineering.

Citação norma Chicago

Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. Perlis, Malaysia: School of Materials Engineering, 2019.

Citação norma MLA

Rita Mohd Said. Development of a Robust Sn-Cu Based Lead-free Solder Paste. School of Materials Engineering, 2019.

Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.