Development of a robust Sn-Cu based lead-free solder paste
This research concentrated on an evolution in lead-free Sn-Cu based solder paste properties for electrical and electronic application and high power electronic devices. The main purposes of this project are listed as the followings; to compare the thermal properties, printability and solderability o...
שמור ב:
| מחבר ראשי: | |
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| מחבר תאגידי: | |
| פורמט: | Thesis ספר |
| שפה: | English |
| יצא לאור: |
Perlis, Malaysia
School of Materials Engineering
2019
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| תגים: |
הוספת תג
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| סיכום: | This research concentrated on an evolution in lead-free Sn-Cu based solder paste properties for electrical and electronic application and high power electronic devices. The main purposes of this project are listed as the followings; to compare the thermal properties, printability and solderability of Sn-0.7Cu based solder paste with micro-alloying Ni (Sn-0.7Cu-0.05Ni solder), composite solder (Sn-0.7Cu-0.05Ni-1TiO2) and transient liquid phase soldering Sn-10Cu (TLPS SC10) solder paste; to investigate the as-reflowed microstructure evolution and its effect on mechanical properties of Sn-0.7Cu based solder paste with micro-alloying Ni (Sn-0.7Cu-0.05Ni solder), composite solder (Sn-0.7Cu-0.05Ni-1TiO2) and transient liquid phase soldering Sn-10Cu (TLPS SC10) solder paste; to study the effects of isothermal aging on the bulk solder microstructure, interfacial growth kinetic and mechanical behavior of Sn-0.7Cu based solder paste with micro-alloying Ni (Sn-0.7Cu-0.05Ni solder), composite solder (Sn-0.7Cu-0.05Ni-1TiO2) and transient liquid phase soldering Sn-10Cu (TLPS SC10) solder paste. |
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| תיאור פיזי: | xxiii, 192 pages colour illustration 30 cm. |
| ביבליוגרפיה: | Includes bibliographical references. |