Development of a robust Sn-Cu based lead-free solder paste
This research concentrated on an evolution in lead-free Sn-Cu based solder paste properties for electrical and electronic application and high power electronic devices. The main purposes of this project are listed as the followings; to compare the thermal properties, printability and solderability o...
שמור ב:
| מחבר ראשי: | |
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| מחבר תאגידי: | |
| פורמט: | Thesis ספר |
| שפה: | English |
| יצא לאור: |
Perlis, Malaysia
School of Materials Engineering
2019
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| תגים: |
הוספת תג
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