Development of a robust Sn-Cu based lead-free solder paste
This research concentrated on an evolution in lead-free Sn-Cu based solder paste properties for electrical and electronic application and high power electronic devices. The main purposes of this project are listed as the followings; to compare the thermal properties, printability and solderability o...
Wedi'i Gadw mewn:
| Prif Awdur: | |
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| Awdur Corfforaethol: | |
| Fformat: | Traethawd Ymchwil Llyfr |
| Iaith: | English |
| Cyhoeddwyd: |
Perlis, Malaysia
School of Materials Engineering
2019
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| Tagiau: |
Ychwanegu Tag
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
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