Development of a robust Sn-Cu based lead-free solder paste
This research concentrated on an evolution in lead-free Sn-Cu based solder paste properties for electrical and electronic application and high power electronic devices. The main purposes of this project are listed as the followings; to compare the thermal properties, printability and solderability o...
Na minha lista:
| Autor principal: | |
|---|---|
| Autor Corporativo: | |
| Formato: | Tese Livro |
| Idioma: | English |
| Publicado em: |
Perlis, Malaysia
School of Materials Engineering
2019
|
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|
Search Result 1
Search Result 2
Search Result 3
