Development of a robust Sn-Cu based lead-free solder paste
This research concentrated on an evolution in lead-free Sn-Cu based solder paste properties for electrical and electronic application and high power electronic devices. The main purposes of this project are listed as the followings; to compare the thermal properties, printability and solderability o...
Saved in:
| Main Author: | |
|---|---|
| Corporate Author: | |
| Format: | Thesis Book |
| Language: | English |
| Published: |
Perlis, Malaysia
School of Materials Engineering
2019
|
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
System Under Maintenance
Our Library Management System is currently under maintenance.
Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance: