Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

Wedi'i Gadw mewn:

Manylion Llyfryddiaeth
Prif Awdur:	Gilleo, Ken (Awdur)
Fformat:	Llyfr
Iaith:	English
Cyhoeddwyd:	New York McGraw-Hill 2004
Pynciau:	Ball grid array technology Microelectronics packaging
Mynediad Ar-lein:	Click here to view the full text content
Tagiau:	Ychwanegu Tag Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!

Eitemau Tebyg

Area array packaging materials : adhesives, pastes and lead-free /
Cyhoeddwyd: (2004)

Area array packing handbook : manufacturing and assembly /
gan: Gilleo, Ken
Cyhoeddwyd: (2002)

Area array packaging handbook manufacturing and assembley
gan: Gilleo, Ken
Cyhoeddwyd: (2002)

Area array packaging handbook manufacturing and assembley
gan: Gilleo, Ken
Cyhoeddwyd: (2002)

Area array packaging handbook : manufacturing and assembly /
Cyhoeddwyd: (2002)

Area array packing handbook : manufacturing and assembly /
gan: Gilleo, Ken
Cyhoeddwyd: (2002)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
gan: Muhammad Nubli Bin Zulkifli
Cyhoeddwyd: (2008)

Ball grid array technolog : edited by John H Lau.
Cyhoeddwyd: (1995)

MEMS/MOEMS packaging : concepts, designs, materials and processes /
gan: Gilleo, Ken
Cyhoeddwyd: (2005)

MEMS/MOEMS packaging : concepts, designs, materials, and processes /
gan: Gilleo, Ken
Cyhoeddwyd: (2005)

MEMS/MOEMS packaging : concepts, designs, materials and processes /
gan: Gilleo, Ken
Cyhoeddwyd: (2005)

MEMS/MOEMS packaging concepts, designs, materials, and processes
gan: Gilleo, Ken
Cyhoeddwyd: (2005)

MEMS/MOEMS packaging concepts, designs, materials, and processes
gan: Gilleo, Ken
Cyhoeddwyd: (2005)

Semiconductor packaging : materials interaction and reliability /
gan: Chen, Andrea
Cyhoeddwyd: (2012)

Semiconductor packaging : materials interaction and reliability /
gan: Chen, Andrea
Cyhoeddwyd: (2012)

Microelectronic packaging /
Cyhoeddwyd: (2005)

Microelectronic packaging /
Cyhoeddwyd: (2005)

Introduction to microsystem packaging technology /
gan: Jin, Yufeng
Cyhoeddwyd: (2011)

Semiconductor Packaging (EMT 453/3) /

Bio and nano packaging techniques for electron devices /
Cyhoeddwyd: (2012)

Introduction to microsystem packaging technology
gan: Jin, Yufeng
Cyhoeddwyd: (2011)

Introduction to microsystem packaging technology
gan: Jin, Yufeng
Cyhoeddwyd: (2011)

Area array package design : techniques in high-density electronics /
Cyhoeddwyd: (2004)

Area array package design : techniques in high-density electronics /
Cyhoeddwyd: (2004)

Area array packaging processes : for BGA, flip chip and CSP /
Cyhoeddwyd: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Hermeticity testing of MEMS and microelectronic packages /
gan: Costello, Suzanne, et al.
Cyhoeddwyd: (2013)

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
gan: Liu, Sheng
Cyhoeddwyd: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
gan: Liu, Sheng
Cyhoeddwyd: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
gan: Liu, Sheng
Cyhoeddwyd: (2011)

Introduction to system-on-package (SOP) : miniaturization of the entire system /
gan: Tummala, Rao R.
Cyhoeddwyd: (2008)

Fundamentals of microsystems packaging
Cyhoeddwyd: (2001)

Fundamentals of microsystems packaging
Cyhoeddwyd: (2001)

Foldable flex and thinned silicon multichip packaging technology /
Cyhoeddwyd: (2003)

Introduction to system-on-package (SOP) miniaturization of the entire system
gan: Tummala, Rao R.
Cyhoeddwyd: (2008)

Introduction to system-on-package (SOP) miniaturization of the entire system
gan: Tummala, Rao R.
Cyhoeddwyd: (2008)

Introduction to system-on-package (SOP) : miniaturization of the entire system /
gan: Tummala, Rao R.
Cyhoeddwyd: (2008)

Fundamentals of microsystems packaging /
Cyhoeddwyd: (2001)

Fundamentals of microsystems packaging /
Cyhoeddwyd: (2001)

Materials for advanced packaging /
Cyhoeddwyd: (2009)