Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

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Bibliografiske detaljer
Hovedforfatter:	Gilleo, Ken (Author)
Format:	Bog
Sprog:	English
Udgivet:	New York McGraw-Hill 2004
Fag:	Ball grid array technology Microelectronics packaging
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Lignende værker

Area array packaging materials : adhesives, pastes and lead-free /
Udgivet: (2004)

Area array packing handbook : manufacturing and assembly /
af: Gilleo, Ken
Udgivet: (2002)

Area array packaging handbook manufacturing and assembley
af: Gilleo, Ken
Udgivet: (2002)

Area array packaging handbook manufacturing and assembley
af: Gilleo, Ken
Udgivet: (2002)

Area array packaging handbook : manufacturing and assembly /
Udgivet: (2002)

Area array packing handbook : manufacturing and assembly /
af: Gilleo, Ken
Udgivet: (2002)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
af: Muhammad Nubli Bin Zulkifli
Udgivet: (2008)

Ball grid array technolog : edited by John H Lau.
Udgivet: (1995)

MEMS/MOEMS packaging : concepts, designs, materials and processes /
af: Gilleo, Ken
Udgivet: (2005)

MEMS/MOEMS packaging : concepts, designs, materials, and processes /
af: Gilleo, Ken
Udgivet: (2005)

MEMS/MOEMS packaging : concepts, designs, materials and processes /
af: Gilleo, Ken
Udgivet: (2005)

MEMS/MOEMS packaging concepts, designs, materials, and processes
af: Gilleo, Ken
Udgivet: (2005)

MEMS/MOEMS packaging concepts, designs, materials, and processes
af: Gilleo, Ken
Udgivet: (2005)

Semiconductor packaging : materials interaction and reliability /
af: Chen, Andrea
Udgivet: (2012)

Semiconductor packaging : materials interaction and reliability /
af: Chen, Andrea
Udgivet: (2012)

Microelectronic packaging /
Udgivet: (2005)

Microelectronic packaging /
Udgivet: (2005)

Introduction to microsystem packaging technology /
af: Jin, Yufeng
Udgivet: (2011)

Semiconductor Packaging (EMT 453/3) /

Bio and nano packaging techniques for electron devices /
Udgivet: (2012)

Introduction to microsystem packaging technology
af: Jin, Yufeng
Udgivet: (2011)

Introduction to microsystem packaging technology
af: Jin, Yufeng
Udgivet: (2011)

Area array package design : techniques in high-density electronics /
Udgivet: (2004)

Area array package design : techniques in high-density electronics /
Udgivet: (2004)

Area array packaging processes : for BGA, flip chip and CSP /
Udgivet: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Hermeticity testing of MEMS and microelectronic packages /
af: Costello, Suzanne, et al.
Udgivet: (2013)

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
af: Liu, Sheng
Udgivet: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
af: Liu, Sheng
Udgivet: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
af: Liu, Sheng
Udgivet: (2011)

Introduction to system-on-package (SOP) : miniaturization of the entire system /
af: Tummala, Rao R.
Udgivet: (2008)

Fundamentals of microsystems packaging
Udgivet: (2001)

Fundamentals of microsystems packaging
Udgivet: (2001)

Foldable flex and thinned silicon multichip packaging technology /
Udgivet: (2003)

Introduction to system-on-package (SOP) miniaturization of the entire system
af: Tummala, Rao R.
Udgivet: (2008)

Introduction to system-on-package (SOP) miniaturization of the entire system
af: Tummala, Rao R.
Udgivet: (2008)

Introduction to system-on-package (SOP) : miniaturization of the entire system /
af: Tummala, Rao R.
Udgivet: (2008)

Fundamentals of microsystems packaging /
Udgivet: (2001)

Fundamentals of microsystems packaging /
Udgivet: (2001)

Materials for advanced packaging /
Udgivet: (2009)