Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

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Opis bibliograficzny
1. autor:	Gilleo, Ken (Autor)
Format:	Książka
Język:	English
Wydane:	New York McGraw-Hill 2004
Hasła przedmiotowe:	Ball grid array technology Microelectronics packaging
Dostęp online:	Click here to view the full text content
Etykiety:	Dodaj etykietę Nie ma etykietki, Dołącz pierwszą etykiete!

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