Area array packaging materials : adhesive, paste and lead free /

Area array packaging materials : adhesive, paste and lead free /

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Библиографические подробности
Главный автор:	Gilleo, Ken (Автор)
Формат:	‌
Язык:	English
Опубликовано:	New York McGraw-Hill 2004
Предметы:	Ball grid array technology Microelectronics packaging
Online-ссылка:	Click here to view the full text content
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