Area array package design : techniques in high-density electronics /

Area array package design : techniques in high-density electronics /

अन्य संस्करण दिखाएं (1)

में बचाया:

ग्रंथसूची विवरण
अन्य लेखक:	Gilleo, Ken
स्वरूप:	पुस्तक
भाषा:	English
प्रकाशित:	New York McGraw-Hill 2004
विषय:	Electronic packaging > Design
टैग :	टैग जोड़ें कोई टैग नहीं, इस रिकॉर्ड को टैग करने वाले पहले व्यक्ति बनें!

समान संसाधन

Area array package design : techniques in high-density electronics /
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Area array packaging handbook : manufacturing and assembly /
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Area array packaging handbook manufacturing and assembley
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Area array packaging handbook manufacturing and assembley
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Principles of electronic packaging /
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Packaging of electronic systems : a mechanical engineering approach /
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Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
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Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
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Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
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Electronic packaging : materials and their properties /
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Journal of electronic packaging.
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Principles of electronic packaging /
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Materials for electronic packaging /
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Essentials of electronic packaging a multidisciplinary approach
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Essentials of electronic packaging a multidisciplinary approach
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Handbook of electronic package design /
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Materials for electronic packaging
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Materials for electronic packaging
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Packaging of electronic systems : a mechanical engineering approach /
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Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
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Practical guide to the packaging of electronics thermal and mechanical design and analysis
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Handbook of electronic package design /
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Area array packing handbook : manufacturing and assembly /
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The electronic packaging handbook /
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The electronic packaging handbook /
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Encyclopedia of thermal packaging. Set 1 : thermal packaging techniques /
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