Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology

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Detalles Bibliográficos
Autor Corporativo:	SpringerLink (Online service)
Outros autores:	Tan, Chuan Seng
Formato:	eBook
Idioma:	English
Publicado:	Boston, MA : Springer-Verlag US, 2008.
Subjects:	Engineering Electronics Optical materials Surfaces (Physics)
Acceso en liña:	Click here to view the full text content
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