Advanced MEMS packaging

Advanced MEMS packaging

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Dades bibliogràfiques
Altres autors:	Lau, John H.
Format:	eBook
Idioma:	English
Publicat:	New York McGraw-Hill c2010.
Matèries:	Microelectromechanical systems. Microelectronic packaging.
Accés en línia:	Click here to view the full text content
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