Advanced MEMS packaging

Advanced MEMS packaging

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Библиографические подробности
Другие авторы:	Lau, John H.
Формат:	eКнига
Язык:	English
Опубликовано:	New York McGraw-Hill c2010.
Предметы:	Microelectromechanical systems. Microelectronic packaging.
Online-ссылка:	Click here to view the full text content
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