Advanced MEMS packaging

Advanced MEMS packaging

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Opis bibliograficzny
Kolejni autorzy:	Lau, John H.
Format:	E-book
Język:	English
Wydane:	New York McGraw-Hill c2010.
Hasła przedmiotowe:	Microelectromechanical systems. Microelectronic packaging.
Dostęp online:	Click here to view the full text content
Etykiety:	Dodaj etykietę Nie ma etykietki, Dołącz pierwszą etykiete!

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