APA (7th ed.) Citation

Tong, X. C. (2011). Advanced materials for therma management of electronic packaging. Springer Springer Science+Business Media.

Chicago Style (17th ed.) Citation

Tong, Xingcun Colin. Advanced Materials for Therma Management of Electronic Packaging. New York, NY: Springer Springer Science+Business Media, 2011.

MLA (8th ed.) Citation

Tong, Xingcun Colin. Advanced Materials for Therma Management of Electronic Packaging. Springer Springer Science+Business Media, 2011.