Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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Dades bibliogràfiques
Autor principal:	Tong, Xingcun Colin (Autor)
Autor corporatiu:	SpringerLink (Online service)
Format:	eBook
Idioma:	English
Publicat:	New York, NY Springer Springer Science+Business Media 2011.
Col·lecció:	Springer Series in Advanced Microelectronics, 30
Matèries:	Physics Engineering Electronics Optical materials
Accés en línia:	Click here to view the full text content
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