Advanced materials for therma management of electronic packaging
Wedi'i Gadw mewn:
Prif Awdur: | Tong, Xingcun Colin (Awdur) |
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Awdur Corfforaethol: | SpringerLink (Online service) |
Fformat: | eLyfr |
Iaith: | English |
Cyhoeddwyd: |
New York, NY
Springer Springer Science+Business Media
2011.
|
Cyfres: | Springer Series in Advanced Microelectronics,
30 |
Pynciau: | |
Mynediad Ar-lein: | Click here to view the full text content |
Tagiau: |
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