Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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Bibliografiske detaljer
Hovedforfatter:	Tong, Xingcun Colin (Author)
Institution som forfatter:	SpringerLink (Online service)
Format:	eBog
Sprog:	English
Udgivet:	New York, NY Springer Springer Science+Business Media 2011.
Serier:	Springer Series in Advanced Microelectronics, 30
Fag:	Physics Engineering Electronics Optical materials
Online adgang:	Click here to view the full text content
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Lignende værker

Advanced materials for integrated optical waveguides /
af: Tong Ph.D, Xingcun Colin
Udgivet: (2014)

Advanced materials for thermal management of electronic packaging
af: Tong, Xingcun Colin
Udgivet: (2011)

Advanced materials for thermal management of electronic packaging
af: Tong, Xingcun Colin
Udgivet: (2011)

Advanced flip chip packaging /
Udgivet: (2013)

Bio and nano packaging techniques for electron devices : Advances in electronic device packaging /
Udgivet: (2012)

Handbook of advanced magnetic materials /

Advanced materials and design for electromagnetic interference shielding /
af: Tong, Xingcun Colin
Udgivet: (2009)

Springer Handbook of Electronic and Photonic Materials
af: Kasap, S. O. (Safa O.)
Udgivet: (2007)

Advanced materials and design for electromagnetic interference shielding
af: Tong, Xingcun Colin
Udgivet: (2009)

Advanced materials and design for electromagnetic interference shielding
af: Tong, Xingcun Colin
Udgivet: (2009)

Mechanics of advanced functional materials /
af: Wang, Biao
Udgivet: (2013)

Advanced experimental methods for noise research in nanoscale electronic devices
Udgivet: (2005)

Moisture sensitivity of plastic packages of IC devices
Udgivet: (2010)

Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging
Udgivet: (2007)

Materials for electronic packaging /
Udgivet: (1995)

Advances in optical science and engineering : proceedings of the first international conference, IEM OPTRONIX 2014 /
Udgivet: (2015)

Integrated circuit packaging, assembly and interconnections
af: Greig, William J.
Udgivet: (2007)

Materials for electronic packaging
Udgivet: (1995)

Materials for electronic packaging
Udgivet: (1995)

Flexible electronics : materials and applications /
Udgivet: (2009)

Electronic packaging materials and their properties /
Udgivet: (1999)

Electronic, magnetic and optical materials /
af: Fulay, Pradeep P.
Udgivet: (2010)

Electronic, magnetic, and optical materials /
af: Fulay, Pradeep

Nanotechnology for electronic materials and devices
Udgivet: (2007)

Theory of charge transport in carbon electronic materials /
af: Shuai, Zhigang
Udgivet: (2012)

Laser processing of materials fundamentals, applications and developments /
Udgivet: (2010)

Nonlinear optical properties of materials /
af: Ganeev, Rashid A.
Udgivet: (2013)

Electronic packaging : materials and their properties /
af: Pecht, Michael G.
Udgivet: (1999)

Semiconductor physical electronics
af: Li, Sheng S.
Udgivet: (2006)

ZnO nanocrystals and allied materials /
Udgivet: (2014)

Force sensors for microelectronic packaging applications
af: Schwizer, Jurg
Udgivet: (2005)

Electronic packaging : materials and their properties /
af: Pecht, Michael G.
Udgivet: (1999)

Resonance effects of excitons and electrons : basics and applications /
af: Geru, Ion
Udgivet: (2013)

Molecular modeling and multiscaling issues for electronic material applications /
Udgivet: (2012)

High permittivity gate dielectric materials /
Udgivet: (2013)

Solid-state physics introduction to the theory /
af: Patterson, James
Udgivet: (2010)

Semiconductor modeling techniques /
Udgivet: (2012)

Frontiers in magnetic materials
Udgivet: (2005)

Frontiers in superconducting materials
af: Narlikar, Anant V.
Udgivet: (2005)

Mid-infrared semiconductor optoelectronics /