Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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Détails bibliographiques
Auteur principal:	Tong, Xingcun Colin (Auteur)
Collectivité auteur:	SpringerLink (Online service)
Format:	eBook
Langue:	English
Publié:	New York, NY Springer Springer Science+Business Media 2011.
Collection:	Springer Series in Advanced Microelectronics, 30
Sujets:	Physics Engineering Electronics Optical materials
Accès en ligne:	Click here to view the full text content
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