Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

में बचाया:

ग्रंथसूची विवरण
मुख्य लेखक:	Tong, Xingcun Colin (लेखक)
निगमित लेखक:	SpringerLink (Online service)
स्वरूप:	ई-पुस्तक
भाषा:	English
प्रकाशित:	New York, NY Springer Springer Science+Business Media 2011.
श्रृंखला:	Springer Series in Advanced Microelectronics, 30
विषय:	Physics Engineering Electronics Optical materials
ऑनलाइन पहुंच:	Click here to view the full text content
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