Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

Spremljeno u:

Bibliografski detalji
Glavni autor:	Tong, Xingcun Colin (Autor)
Autor kompanije:	SpringerLink (Online service)
Format:	e-knjiga
Jezik:	English
Izdano:	New York, NY Springer Springer Science+Business Media 2011.
Serija:	Springer Series in Advanced Microelectronics, 30
Teme:	Physics Engineering Electronics Optical materials
Online pristup:	Click here to view the full text content
Oznake:	Dodaj oznaku Bez oznaka, Budi prvi tko označuje ovaj zapis!

Similar Items

Advanced materials for integrated optical waveguides /
od: Tong Ph.D, Xingcun Colin
Izdano: (2014)

Advanced materials for thermal management of electronic packaging
od: Tong, Xingcun Colin
Izdano: (2011)

Advanced materials for thermal management of electronic packaging
od: Tong, Xingcun Colin
Izdano: (2011)

Advanced flip chip packaging /
Izdano: (2013)

Bio and nano packaging techniques for electron devices : Advances in electronic device packaging /
Izdano: (2012)

Handbook of advanced magnetic materials /

Advanced materials and design for electromagnetic interference shielding /
od: Tong, Xingcun Colin
Izdano: (2009)

Springer Handbook of Electronic and Photonic Materials
od: Kasap, S. O. (Safa O.)
Izdano: (2007)

Advanced materials and design for electromagnetic interference shielding
od: Tong, Xingcun Colin
Izdano: (2009)

Advanced materials and design for electromagnetic interference shielding
od: Tong, Xingcun Colin
Izdano: (2009)

Mechanics of advanced functional materials /
od: Wang, Biao
Izdano: (2013)

Advanced experimental methods for noise research in nanoscale electronic devices
Izdano: (2005)

Moisture sensitivity of plastic packages of IC devices
Izdano: (2010)

Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging
Izdano: (2007)

Materials for electronic packaging /
Izdano: (1995)

Advances in optical science and engineering : proceedings of the first international conference, IEM OPTRONIX 2014 /
Izdano: (2015)

Integrated circuit packaging, assembly and interconnections
od: Greig, William J.
Izdano: (2007)

Materials for electronic packaging
Izdano: (1995)

Materials for electronic packaging
Izdano: (1995)

Flexible electronics : materials and applications /
Izdano: (2009)

Electronic packaging materials and their properties /
Izdano: (1999)

Electronic, magnetic and optical materials /
od: Fulay, Pradeep P.
Izdano: (2010)

Electronic, magnetic, and optical materials /
od: Fulay, Pradeep

Nanotechnology for electronic materials and devices
Izdano: (2007)

Theory of charge transport in carbon electronic materials /
od: Shuai, Zhigang
Izdano: (2012)

Laser processing of materials fundamentals, applications and developments /
Izdano: (2010)

Nonlinear optical properties of materials /
od: Ganeev, Rashid A.
Izdano: (2013)

Electronic packaging : materials and their properties /
od: Pecht, Michael G.
Izdano: (1999)

Semiconductor physical electronics
od: Li, Sheng S.
Izdano: (2006)

ZnO nanocrystals and allied materials /
Izdano: (2014)

Force sensors for microelectronic packaging applications
od: Schwizer, Jurg
Izdano: (2005)

Electronic packaging : materials and their properties /
od: Pecht, Michael G.
Izdano: (1999)

Resonance effects of excitons and electrons : basics and applications /
od: Geru, Ion
Izdano: (2013)

Molecular modeling and multiscaling issues for electronic material applications /
Izdano: (2012)

High permittivity gate dielectric materials /
Izdano: (2013)

Solid-state physics introduction to the theory /
od: Patterson, James
Izdano: (2010)

Semiconductor modeling techniques /
Izdano: (2012)

Frontiers in magnetic materials
Izdano: (2005)

Frontiers in superconducting materials
od: Narlikar, Anant V.
Izdano: (2005)

Mid-infrared semiconductor optoelectronics /