Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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書誌詳細
第一著者:	Tong, Xingcun Colin (著者)
団体著者:	SpringerLink (Online service)
フォーマット:	eBook
言語:	English
出版事項:	New York, NY Springer Springer Science+Business Media 2011.
シリーズ:	Springer Series in Advanced Microelectronics, 30
主題:	Physics Engineering Electronics Optical materials
オンライン･アクセス:	Click here to view the full text content
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