Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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Главный автор:	Tong, Xingcun Colin (Автор)
Соавтор:	SpringerLink (Online service)
Формат:	eКнига
Язык:	English
Опубликовано:	New York, NY Springer Springer Science+Business Media 2011.
Серии:	Springer Series in Advanced Microelectronics, 30
Предметы:	Physics Engineering Electronics Optical materials
Online-ссылка:	Click here to view the full text content
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