Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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Bibliografske podrobnosti
Glavni avtor:	Tong, Xingcun Colin (Author)
Korporativna značnica:	SpringerLink (Online service)
Format:	eKnjiga
Jezik:	English
Izdano:	New York, NY Springer Springer Science+Business Media 2011.
Serija:	Springer Series in Advanced Microelectronics, 30
Teme:	Physics Engineering Electronics Optical materials
Online dostop:	Click here to view the full text content
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