Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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Bibliografiska uppgifter
Huvudupphovsman:	Tong, Xingcun Colin (Författare, medförfattare)
Institutionell upphovsman:	SpringerLink (Online service)
Materialtyp:	E-bok
Språk:	English
Publicerad:	New York, NY Springer Springer Science+Business Media 2011.
Serie:	Springer Series in Advanced Microelectronics, 30
Ämnen:	Physics Engineering Electronics Optical materials
Länkar:	Click here to view the full text content
Taggar:	Lägg till en tagg Inga taggar, Lägg till första taggen!

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