Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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書目詳細資料
主要作者:	Tong, Xingcun Colin (Author)
企業作者:	SpringerLink (Online service)
格式:	電子書
語言:	English
出版:	New York, NY Springer Springer Science+Business Media 2011.
叢編:	Springer Series in Advanced Microelectronics, 30
主題:	Physics Engineering Electronics Optical materials
在線閱讀:	Click here to view the full text content
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