Advanced materials for therma management of electronic packaging

Advanced materials for therma management of electronic packaging

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书目详细资料
主要作者:	Tong, Xingcun Colin (Author)
企业作者:	SpringerLink (Online service)
格式:	电子书
语言:	English
出版:	New York, NY Springer Springer Science+Business Media 2011.
丛编:	Springer Series in Advanced Microelectronics, 30
主题:	Physics Engineering Electronics Optical materials
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