Advanced materials for therma management of electronic packaging
Sábháilte in:
Príomhchruthaitheoir: | Tong, Xingcun Colin (Údar) |
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Údar corparáideach: | SpringerLink (Online service) |
Formáid: | Ríomhleabhar |
Teanga: | English |
Foilsithe / Cruthaithe: |
New York, NY
Springer Springer Science+Business Media
2011.
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Sraith: | Springer Series in Advanced Microelectronics,
30 |
Ábhair: | |
Rochtain ar líne: | Click here to view the full text content |
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