Advanced materials for therma management of electronic packaging

Saved in:
Bibliografiske detaljer
Hovedforfatter: Tong, Xingcun Colin (Author)
Institution som forfatter: SpringerLink (Online service)
Format: eBog
Sprog:English
Udgivet: New York, NY Springer Springer Science+Business Media 2011.
Serier:Springer Series in Advanced Microelectronics, 30
Fag:
Online adgang:Click here to view the full text content
Tags: Tilføj Tag
Ingen Tags, Vær først til at tagge denne postø!

System Under Maintenance

Our Library Management System is currently under maintenance.

Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance:

david@pintaran.my

Internet

Click here to view the full text content