Advanced materials for therma management of electronic packaging
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| Main Author: | |
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| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY
Springer Springer Science+Business Media
2011.
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| Series: | Springer Series in Advanced Microelectronics,
30 |
| Subjects: | |
| Online Access: | Click here to view the full text content |
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