Connections in electronic assemblies /
Saved in:
Main Author: | Bilotta, Anthony J. (Author) |
---|---|
Format: | Book |
Language: | English |
Published: |
New York
Marcel Dekker
c1985.
|
Series: | Manufacturing engineering and materials processing
|
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Self alignment of various chip resistor sizes using different silver content solder during reflow soldering process in a static reflow oven /
by: Mohd Najib Ali Mokhtar
Published: (2018) -
Self alignment of various chip resistor sizes using different silver content solder during reflow soldering process in a static reflow oven /
by: Mohd Najib Ali Mokhtar
Published: (2018) -
Reflow soldering processes and troubleshooting : SMT, BGA, CSP and flip chip technologies /
by: Lee, Ning-Cheng
Published: (2002) -
Reflow soldering processes : SMT, BGA, CSP AND flip chip technology /
by: Lee, Ning-Cheng
Published: (2002) -
Reflow soldering processes : SMT, BGA, CSP AND flip chip technology /
by: Lee, Ning-Cheng
Published: (2002)