Solder joint reliability assessment : finite element simulation methodology /

Solder joint reliability assessment : finite element simulation methodology /

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...

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Dettagli Bibliografici
Autore principale:	Tamin, Mohd N. (Autore)
Ente Autore:	SpringerLink (Online service)
Altri autori:	Shaffiar, Norhashimah M.
Natura:	eBook
Lingua:	English
Pubblicazione:	Cham Springer International Publishing 2014.
Serie:	Advanced Structured Materials 37
Soggetti:	Materials. System safety. Surfaces (Physics).
Accesso online:	Click here to view the full text content
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