Solder joint reliability assessment : finite element simulation methodology /
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...
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| Format: | eBook |
| Language: | English |
| Published: |
Cham
Springer International Publishing
2014.
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| Series: | Advanced Structured Materials
37 |
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| Online Access: | Click here to view the full text content |
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Table of Contents:
- Introduction
- Overview of the Simulation Methodology
- Requirements for Finite Element Simulation
- Mechanics of Solder Materials
- Application I: Solder Joint Reflow Process
- Application II: Solder Joints under Temperature and Mechanical Cycles
- Damage Mechanics-based Models
- Application III: Board-level Drop Test with BGA Package
- Fatigue Fracture Process of Solder Joints
- Closure.