Copper wire bonding /

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cos...

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Bibliografiske detaljer
Hovedforfatter: Chauhan, Preeti S. (Author)
Institution som forfatter: SpringerLink (Online service)
Andre forfattere: Choubey, Anupam, Zhong, ZhaoWei, Pecht, Michael G.
Format: eBog
Sprog:English
Udgivet: New York, NY Springer New York 2014.
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