Copper wire bonding /

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cos...

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Bibliografski detalji
Glavni autor: Chauhan, Preeti S. (Autor)
Autor kompanije: SpringerLink (Online service)
Daljnji autori: Choubey, Anupam, Zhong, ZhaoWei, Pecht, Michael G.
Format: e-knjiga
Jezik:English
Izdano: New York, NY Springer New York 2014.
Teme:
Online pristup:Click here to view the full text content
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