Copper electrodeposition for nanofabrication of electronics devices /

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Akolkar, Rohan N. (Editor), Barkey, Dale P. (Editor), Yokoi, Masayuki (Editor), Kondo, Kazuo
Format: eBook
Language:English
Published: New York, NY Springer New York 2014.
Series:Nanostructure Science and Technology,
Subjects:
Online Access:Click here to view the full text content
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Summary:This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners.
Physical Description:1 online resource (VIII, 282 pages.) 190 illustrations., 75 illustrations. in colour. digital
ISBN:9781461491767
ISSN:1571-5744