Copper electrodeposition for nanofabrication of electronics devices /
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...
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Corporate Author: | SpringerLink (Online service) |
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Other Authors: | Akolkar, Rohan N. (Editor), Barkey, Dale P. (Editor), Yokoi, Masayuki (Editor), Kondo, Kazuo |
Format: | eBook |
Language: | English |
Published: |
New York, NY
Springer New York
2014.
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Series: | Nanostructure Science and Technology,
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Subjects: | |
Online Access: | Click here to view the full text content |
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