Copper electrodeposition for nanofabrication of electronics devices /

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon c...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Akolkar, Rohan N. (Editor), Barkey, Dale P. (Editor), Yokoi, Masayuki (Editor), Kondo, Kazuo
Format: eBook
Language:English
Published: New York, NY Springer New York 2014.
Series:Nanostructure Science and Technology,
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