APA (7th ed.) Citation

Gan Chong Leong. (2014). Wearout reliability studies of bonding wires used in nano electronic device packing. Institute of Nano Electronic Engineering, Universiti Malaysia Perlis.

Chicago Style (17th ed.) Citation

Gan Chong Leong. Wearout Reliability Studies of Bonding Wires Used in Nano Electronic Device Packing. Perlis, Malaysia: Institute of Nano Electronic Engineering, Universiti Malaysia Perlis, 2014.

MLA (8th ed.) Citation

Gan Chong Leong. Wearout Reliability Studies of Bonding Wires Used in Nano Electronic Device Packing. Institute of Nano Electronic Engineering, Universiti Malaysia Perlis, 2014.